High-Density Integrated Electrocortical Neural Interfaces
暫譯: 高密度整合電皮質神經介面
Ha, Sohmyung, Cauwenberghs, Gert, Kim, Chul
- 出版商: Academic Press
- 出版日期: 2019-08-06
- 售價: $4,610
- 貴賓價: 9.5 折 $4,380
- 語言: 英文
- 頁數: 220
- 裝訂: Quality Paper - also called trade paper
- ISBN: 0128151153
- ISBN-13: 9780128151150
海外代購書籍(需單獨結帳)
商品描述
High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field--Dr. Sohmyung Ha and Dr. Gert Cauwenberghs--the book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included.
These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface.
- Written by leading researchers in electrocorticography in brain-computer interfaces
- Offers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulation
- Covers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing
商品描述(中文翻譯)
《高密度整合電皮質神經介面》提供了對電皮質神經介面的基本理解、設計策略和實施應用,重點在於整合電路設計技術。本書涵蓋了與電皮質神經植入物的設計和應用相關的各種主題。由該領域的領先專家--哈宗明博士(Dr. Sohmyung Ha)和蓋特·考文伯赫斯博士(Dr. Gert Cauwenberghs)撰寫,書中討論了電皮質圖譜(electrocorticography)、電極介面、信號獲取、電力供應、數據通信和刺激的基本原則和實用設計策略。此外,還包括了對最先進研究的概述和批判性回顧。
這些方法論為開發能夠解析微尺度神經活動的微創腦-電腦介面提供了一條途徑,並能廣泛覆蓋皮質表面。
- 由腦-電腦介面領域的電皮質圖譜領先研究者撰寫
- 獨特地專注於神經介面電路設計,涵蓋從電極到介面、電路、供電、通信和封裝
- 涵蓋最新的ECoG介面系統和ECoG及生物電位感測的電極介面