Signal and Power Integrity - Simplified, 3/e (Hardcover)

Eric Bogatin

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商品描述

The #1 Practical Guide to Signal Integrity Design—with Revised Content and New Questions and Problems!

This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.

• A fully up-to-date introduction to signal integrity and physical design
• New questions and problems designed for both students and professional engineers
• How design and technology selection can make or break power distribution network performance
• Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
• Practical techniques for analyzing resistance, capacitance, inductance, and impedance
• Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances
• Identifying reflections and crosstalk with free animation tools
• Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
• Understanding how interconnect physical design impacts signal integrity
• Managing differential pairs and losses
• Harnessing the full power of S-parameters in high-speed serial link applications
• Designing high-speed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams
• Ensuring power integrity throughout the entire power distribution path
• Realistic design guidelines for improving signal integrity, and much more

For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.
 

商品描述(中文翻譯)

《信號完整性設計的實用指南#1 —— 內容修訂和新問題和問題!》這本書匯集了最新的技術,幫助您找到、修復和避免設計中的信號完整性問題。世界知名專家Eric Bogatin根據他教授數千名工程師和研究生的經驗,系統地介紹了信號完整性、電源完整性和電磁兼容性問題的六個根本原因。Bogatin回顧了理解這些問題所需的基本原則,並展示了如何在設計週期的早期使用最佳設計實踐和技術來預防或解決這些問題。為了幫助測試和鞏固您的理解,這個新版本增加了問題和問題。Bogatin還使用免費工具提供更多示例,並新增了關於高速串行連接的內容,反映了他的130多名研究生的意見。

• 信號完整性和物理設計的最新介紹
• 為學生和專業工程師設計的新問題和問題
• 設計和技術選擇如何影響電源分配網絡性能的優劣
• 探索關鍵概念,如平面阻抗、擴散電感、解耦電容和電容迴路電感
• 分析電阻、電容、電感和阻抗的實用技術
• 使用QUCS預測波形,因為連接阻抗影響電壓源
• 使用免費動畫工具識別反射和串擾
• 通過經驗法則、分析近似、數值模擬和測量解決信號完整性問題
• 理解連接物理設計如何影響信號完整性
• 管理差分對和損耗
• 充分利用高速串行連接應用中的S參數
• 設計與差分對和有損線相關的高速串行連接,包括對眼圖的新覆蓋範圍
• 確保整個電源分配路徑的電源完整性
• 改善信號完整性的實用設計指南等等

對於各級經驗的專業人士和學生,本書強調直觀理解、實用工具和工程紀律,而不是理論推導或數學嚴謹性。它贏得了當之無愧的聲譽,成為獲得信號完整性設計正確的#1資源 —— 每次都是第一次。